Metallization Capabilities

  • Formulation Lab
  • Thick film metallization process
  • Produce Tungsten, Dielectric ink & Lamination solution
  • Yungsten paste 3 roll milling
  • Measuring Viscosity
  • Used on Alumina and Beryllia substrates
  • Co fire & Post fire applications
  • Inks made for various firing temperatures 1400°C-1600°C.